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| (R) TN4035-600G 40A SCRs MAIN FEATURES: Symbol IT(RMS) VDRM/VRRM IGT Value 40 600 35 Unit A V mA G A K A DESCRIPTION The TN4035-600G is designed for applications where in-rush current conditions are critical, such as overvoltage crowbar protection circuits in power supplies. Using clip assembly technology, provides higher fusing threshold than wires. Mounting precautions detailled in application note AN533 on www.st.com. KA G D2PAK ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) IT(AV) ITSM Parameter RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range Maximum peak reverse gate voltage F = 60 Hz tp = 20 s tp = 8.3 ms tp = 10 ms Tj = 25C Tj = 125C Tj = 125C Tj = 125C Tc = 95C Tc = 95C Tj = 25C Value 40 25 480 460 1060 50 4 1 - 40 to + 150 - 40 to + 125 5 A2S A/s A W C V Unit A A A I t dI/dt IGM PG(AV) Tstg Tj VRGM April 2004 - Ed: 3 1/5 TN4035-600G ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified) Symbol IGT VD = 12 V VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM ITM = 80 A Gate open Tj = 125C Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C tp = 380 s RL = 3.3 k Gate open Tj = 125C RL = 33 Test Conditions MIN. MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. Value 3.5 35 1.3 0.2 75 150 1000 1.6 0.85 10 5 4 Unit mA V V mA mA V/s V V m A mA Threshold voltage Dynamic resistance VDRM = VRRM THERMAL RESISTANCES Symbol Rth(j-c) Rth(j-a) Junction to case (DC) Junction to ambient (DC) S = 1cm2 (*) Parameter Value 0.8 45 Unit C/W C/W * Surface under tab/Epoxy printed circuit board FR4, copper thickness 85m ORDERING INFORMATION TN STANDARD SCR SERIES 40 CURRENT: 40A 35 - 600 G (-TR) VOLTAGE: 600: 600V PACKAGE: G: D2PAK PACKING MODE: Blank: Tube -TR: Tape & Reel SENSITIVITY: 35: 35mA OTHER INFORMATION Part Number TN4035-600G TN4035-600G-TR Marking TN4035-600G TN4035-600G Weight 1.5 g 1.5 g Base Quantity 50 1000 Packing mode Tube Tape & Reel Epoxy meets UL94, V0 2/5 TN4035-600G Fig. 1: Maximum average power dissipation versus average on-state current. P(W) 40 35 30 25 20 15 10 5 0 0 5 10 IT(av)(A) 15 20 360 Fig. 2: Average and DC on-state current versus case temperature. IT(av)(A) 50 = 180 40 30 20 10 D.C. = 180 Tcase(C) 25 30 0 0 25 50 75 100 125 Fig. 3: Relative variation of thermal impedance versus pulse duration. Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature. IGT,IH,IL [Tj] / IGT,IH,IL [Tj = 25 C] 2.5 K = [Zth/Rth] 1.00 Zth(j-c) 2.0 IGT 1.5 0.10 Zth(j-a) 1.0 0.5 tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.0 -40 IH & IL Tj(C) -20 0 20 40 60 80 100 120 140 Fig. 5: Surge peak on-state current versus number of cycles. Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding value of It. ITSM(A),I 2t(A2s) 5000 Tj initial = 25 C ITSM I2t ITSM(A) 500 450 400 350 300 250 200 150 100 50 0 tp = 10ms Non repetitive Tj initial = 25 C One cycle 1000 dI/dt limitattion Repetitive Tcase = 95 C Number of cycles 1 10 100 1000 100 0.01 0.10 tp(ms) 1.00 10.00 3/5 TN4035-600G Fig. 7: values). On-state characteristics (maximum Fig. 8: Thermal resistance junction to ambient versus surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m) Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 ITM(A) 500 Tj max.: Vto = 0.85V Rd = 10m Tj = Tj max. 100 10 Tj = 25C 1 0.0 VTM(V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S(cm) 0 10 20 30 40 50 0 4/5 TN4035-600G PACKAGE MECHANICAL DATA D2PAK JEDEC REFERENCE: TO-263 DIMENSIONS A E L2 C2 REF. Millimeters Min. Typ. Max. 4.60 2.69 0.23 0.93 Min. Inches Typ. Max. D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R A A1 A2 B B2 C C2 D E G L L2 L3 R V2 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0 1.40 0.40 0.169 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.048 0.055 0.60 0.017 0.024 1.36 0.047 0.054 9.35 0.352 0.368 10.28 0.393 0.405 5.28 0.192 0.208 15.85 0.590 0.624 1.40 0.050 0.055 1.75 0.055 0.069 0.016 8 0 8 FOOTPRINT DIMENSIONS (in millimeters) D2PAK (Plastic) 16.90 10.30 1.30 5.08 3.70 8.90 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com 5/5 |
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